IN BRIEF: EnSilica announces new debt facility of up to GBP9 million
EnSilica PLC - Oxfordshire, England-based chip maker of mixed signal application specific integrated circuits, or ASICs - Secures new debt facility to refinance its existing external loan facilities. Facility provides total funding of up to GBP9 million and extends to November 2029. "The facility has been agreed with Lloyds Bank Group PLC, providing the company with additional flexibility to underpin ongoing working capital commitments, and ensuring that EnSilica can fully capitalise on its existing new business pipeline," EnSilica adds. The financing includes a three-year GBP3 million repayment term loan facility and a five-year GBP3 million revolving credit facility with an accordion option for an additional GBP3 million.
"Th facility also improves the borrowing costs of the company. The facility agreements contain normal market terms and financial covenants," EnSilica adds.
Current stock price: 51.50 pence
12-month change: down 24%
By Eric Cunha, Alliance News news editor
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